Advanced Molding Technology
Triply Enhanced Thermal Conductivity
Advanced Molding Technology infused foam offers superior thermal conductivity by combining three highly conductive materials: open-cell high air-flow Advanced Memory Foam, ThermaGel™, and the super-conducting graphite. The result is a 46% enhancement of regular open-cell visco heat flow, and up to 7 times better conductivity than that of conventional memory foam.
Graphite infusion greatly improves heat transfer when the foam is compressed, leading to restricted air-flow that inhibits convective heat transfer. This is accomplished when graphite and gel particles are compressed closely together, allowing for heat transfer through the particles toward uncompressed parts of the foam where heat can be liberated through convection.
- Compression-conduction technology
- Variable support and compression distribution
- Extensive temperature performance range
- Promotes softness and durability
- Provides a highly conductive pathway for heat to move toward uncompressed adjacent foam where heat can be liberated by convection
Advanced Molding Technology infusion encompasses the exceptional performance characteristics of gel, providing superior comfort and durability. Gel infusion technology offers enhanced support in deep compression areas, where individual gel particles interact to add the pressure response characteristics of pure gel to the softness and comfort of viscoelastic foam. Combining graphite with gel significantly enhances the overall thermal conductivity, while maintaining the superior support character of gel.
Integration of gel into viscoelastic foam results in a widening of the glass transition temperature range of conventional memory foam. This allows ThermaGel™ to provide great pressure relief and comfort through a wide range of temperatures, without getting stiff at low temperatures like conventional memory foam.